基于数字散斑相关的封装热机械耦合效应测量  

Measurement of Thermomechanical Coupling Effect in Packaging Structures Based on DSCM

作　　者：陈凡秀[1] 何小元[2] 徐振斌[2] 李明[3] 宋竞[3] 

机构地区：[1]青岛理工大学理学院,山东青岛266033 [2]东南大学工程力学系,江苏南京210096 [3]东南大学MEMS教育部重点实验室,江苏南京210096

出　　处：《光电子．激光》2007年第10期1228-1230,共3页Journal of Optoelectronics·Laser

基　　金：国家自然科学基金资助项目(10472026);国家重点基础研究专项经费资助项目(2006CB300404)

摘　　要：利用数字散斑相关方法(DSCM),对COB封装结构在热循环状态下的表面热机械耦合效应进行了测量。利用CCD摄像机采集封装芯片在不同温度场中的散斑图像,对比采集到的图像,获取封装芯片在温度场作用下的面内变形。根据三角法测量技术原理,将离面位移的测量转化为面内位移的测量,从而获得了芯片受热后的翘曲形变和弹性应变分布。将实验测量与有限元模拟以及理论计算的结果进行了对比,3种结果吻合得比较好,表明了实验方法的有效性和可行性。Digital speckle correlation method（DSCM） is used to measure the thermomechanieal coupling effect in COB packaging structures. The CCD camera is applied to capture the speckle patterns of CMOS chip at different temperature fields, by analyzing the speckle patterns,the in-plane deformation of the CMOS chip is obtained, Based on the trigonometrical theory, the out-plane displacement can be obtained by measuring the in-plane displacement,and then the elasticity thermal stress of the chip is evaluated when the application of the temperature field is repeated. The experiment results agree well with that of FEM simulations and the theoretical model. It is proved that DSCM can successfully be applied to the analysis of the ther momechanical coupling effect. The theoretical model is also verified by the result of FEM simulations and experimental testing. The experiment results provide a availability reference to the design of MEMS aparatus.

关 键 词：热机械耦合 数字散斑相关方法(DSCM) CMOS芯片 封装 

分 类 号：O348[理学—固体力学] O484[理学—力学]