集成电路版图中的多边形匹配比较研究  

Design of polygon matching and comparison in IC layout

作　　者：史峥[1] 高晓莹[1] 任杰[1] 施怡雯[1] 

机构地区：[1]浙江大学超大规模集成电路设计研究所,浙江杭州310027

出　　处：《机电工程》2007年第10期32-35,共4页Journal of Mechanical & Electrical Engineering

摘　　要：光学邻近校正是最重要的分辨率增强技术,而对光学邻近校正后的版图修正逐渐成为提高集成电路版图质量的必需步骤。提出了一种用于post-OPC版图(做过OPC的版图)修正的多边形匹配比较的线性算法。算法通过比较pre-OPC和post-OPC的版图,提取OPC校正时的分段信息和段偏移量,使得post-OPC版图的修正能够充分利用前次OPC的结果,避免了重做OPC,提高了OPC验证后修正的效率。Optical proximity correction （OPC） is the most important RET and post-OPC fixing technique has become a necessary process to improve the OPC quality. A liner polygon matching and comparison algorithm for post-OPC fixing technique were presented. By comparing the pre-OPC and post-OPC layout, it recognized and recorded the fragmentation and offset information. Therefore the post-OPC fixing process can reuse the previous OPC result. By avoiding redoing OPC all-over again, the entire processing efficiency was highly improved.

关 键 词：可制造性设计 光学邻近校正 分辨率增强技术 多边形匹配比较 

分 类 号：TN305[电子电信—物理电子学]