热超声键合过程中键合力波动特性仿真研究  

Research on Oscillation Characteristics of Bonding Force during Thermosonic Bonding

作　　者：何俊[1] 郭永进[1] 林忠钦[1] 

机构地区：[1]上海交通大学机械与动力工程学院,上海200240

出　　处：《上海交通大学学报》2007年第10期1704-1709,共6页Journal of Shanghai Jiaotong University

基　　金：国家自然科学基金重大项目(50390060)

摘　　要：利用有限元分析方法研究了在铜金属化晶片上进行金引线热超声键合过程中的键合力变化情况,建立了基于率相关材料特性的热超声键合有限元模型,对键合中的碰撞和超声两个过程进行了仿真分析,并引入平均键合力、键合力标准差值等统计参量来判定键合力的波动变化,从而更加准确地揭示了各键合参数对键合力波动的影响规律.研究结果表明:碰撞初速度(v0)、超声时间或键合温度的增加,均会使得键合力的波动加剧,不利于键合力的控制;对于v1/v0(v1为劈刀速度)则存在一个合适的值,可以使得键合力的波动变化最小.The thermo-sonic Au wire bonding on Cu/Low-K wafers, which involves impact and ultrasonic stages, was modeled and simulated. The model is based on finite element method for the rate sensitive materials. Some statistical variables such as the average and standard deviation of bonding forces were defined. So the vibration of bonding force due to the change of bonding parameters was described accurately. The oscillation of bonding force becomes stronger with the increase of initial impact velocity, ultrasonic time or bonding temperature. It can also be found that there is a proper v1/v0 value which makes the oscillation of bonding force become minimum.

关 键 词：热超声键合 键合力 波动特性 率效应 

分 类 号：TN305[电子电信—物理电子学]