氧化铝陶瓷金属化技术的研究进展  

Progress of Research on the Alumina Ceramics Metallization

作　　者：马元远[1] 王德苗[1] 任高潮[1] 

机构地区：[1]浙江大学信电系,浙江杭州310027

出　　处：《真空电子技术》2007年第5期41-43,47,共4页Vacuum Electronics

摘　　要：综述了Al2O3陶瓷金属化技术的国内外研究现状与进展,简要介绍了目前主要应用的几种金属化方法,并着重分析了真空溅射镀膜金属化技术中薄膜材料、膜层厚度以及工艺参数对金属化质量的影响。Recent domestic and international developments of alumina ceramics metallization were reviewed. Several commonly used metallization techniques were introduced. The influence on metallization quality cased by the film material, thickness and technique parameters in vacuum sputtering were analyzed.

关 键 词：AL2O3陶瓷 金属化 真空溅射 

分 类 号：TB756[一般工业技术—真空技术]