热致封装效应对MEMS固支梁谐振频率的影响  

Thermally Induced Packaging Effect on the Resonant Frequencies of a Fixed-Fixed Beam

作　　者：李明[1] 宋竞[1] 黄庆安[1] 唐洁影[1] 

机构地区：[1]东南大学MEMS教育部重点实验室,南京210096

出　　处：《Journal of Semiconductors》2008年第1期157-162,共6页半导体学报（英文版）

基　　金：装备预先研究基金资助项目(批准号:51308050105)~~

摘　　要：MEMS器件的封装效应显著而复杂,其中由贴片封装引起的结构热失配是封装效应的主要成因.论文在前期封装-器件耦合行为模型的基础上,利用激光多普勒测振仪实验验证了贴片工艺的热致封装效应对固支梁器件性能的影响.结果表明,贴片前后固支梁的谐振频率发生显著变化,并沿芯片表面表现出明显的分布特征.考虑封装效应的理论模型可以较好地预测该结果,为MEMS系统的器件-封装协同设计提供理论指导.To characterize the effect of deformation of die-bonding packages on the performance of MEMS devices,a laser scanning vibrometer was used, based on the theory of vibration analysis and signal processing. Because it is a commonly used structure in MEMS design,a surface micromachined polysilicon fixed-fixed beam was chosen. Its resonant frequencies from the 1st to the 3rd order were recorded before and after die bonding and compared to FEM simulations. The results suggest that the thermo-mechanical coupling deformation in the multilayer packaging structure affects the performance of MEMS device remarkably,and the resonant frequencies shift of the beam are more than 15% - 30%. Therefore,it is possible to include the package effect in the primary design circle of MEMS devices,which may enhance the device performance and shorten the primary design cycle.

关 键 词：MEMS 封装效应 固支梁 谐振频率 协同设计 

分 类 号：TP211.4[自动化与计算机技术—检测技术与自动化装置]