等离子体清洗及其在电子封装中的应用  

Plasma Cleaning and Its Application in Electronics Packaging

作　　者：龙乐 

机构地区：[1]成都龙泉天生路205号1栋208室,成都610100

出　　处：《电子与封装》2008年第4期12-15,共4页Electronics & Packaging

摘　　要：等离子体工艺是干法清洗应用中的重要部分,随着微电子技术的发展,等离子体清洗的优势越来越明显。文章介绍了等离子体清洗的特点和应用,讨论了它的清洗原理和优化设计方法。最后分析了等离子体清洗工艺的关键技术及解决方法。The plasma process is an important part of the dry cleaning＇s application. Plasma cleaning is getting more and more obvious advanced in the deveelopment of the microelectronic technology. This text introduced the characteristic and application of the plasma cleaning including its cleaning principle and the design method. The key technology and solution was analyzed at last.

关 键 词：干法清洗 清洗 等离子体 电子封装 

分 类 号：TN305.94[电子电信—物理电子学]