MEMS器件自动引线键合系统  

Automatic wire bonding system for MEMS sensor packaging

作　　者：陈立国[1] 杨治亮[1] 马凌宇[1] 孙立宁[1] 

机构地区：[1]哈尔滨工业大学机器人研究所,哈尔滨150080

出　　处：《功能材料与器件学报》2008年第2期308-312,共5页Journal of Functional Materials and Devices

基　　金：国家863项目支持(No.2006AA04Z256)

摘　　要：引线键合是MEMS传感器最常用的封装形式之一,传统IC引线键合设备的批量制造特点限制了MEMS制造的灵活性。本文将连续变倍显微镜作为视觉传感器建立柔性显微视觉系统,并与改造后的手动引线键合机相结合,建立了面向MEMS的自动引线键合系统。通过分析变倍显微镜的成像模型提出了一种适用于变倍显微镜的自动调焦方法,以获取不同倍数下的清晰图像。利用变倍显微镜可以连续变倍的特点,在低放大倍数下进行大范围粗定位,高放大倍数下进行精定位,从而实现大范围高精度定位。最后通过实验验证了该系统的实用性。Wire bonding is widely used for MEMS sensors packaging, but the conventional IC wire bonder limited the flexibility of the MEMS for the batch machining character. A manual wire bonder is reconstructed and integrated with vision feedback system based on zoom microscope for automatic packaging of MEMS sensors. A new autofocusing method for zoom microscope is proposed based on the analysis of zoom microscope model for acquiring good image in different magnification. Taking advantage of the zoom function of microscope, objects can be identified and located roughly with low magnification, and the precise position of objects can be calculated accurately with high magnification image. At last, the productivity of the flexible wire bonder is validated through a wire bonding experiment for MEMS pressure sensors.

关 键 词：MEMS 引线键合 显微视觉 

分 类 号：TP24[自动化与计算机技术—检测技术与自动化装置]