MEMS器件真空回流焊接工艺研究  

Research on Vacuum Reflow Packaging Process for MEMS Device

作　　者：薛中会[1] 关荣锋[1] 

机构地区：[1]河南理工大学,河南焦作454002

出　　处：《河南大学学报（自然科学版）》2008年第3期235-238,共4页Journal of Henan University:Natural Science

基　　金：国家"863"项目(2005AA404260;2006AA04Z346);河南省科技攻关项目(0624220036)

摘　　要：选择80Au20Sn合金预制焊料,在多功能键合设备中研究了MEMS器件陶瓷外壳真空回流焊接工艺.通过多次工艺实验,获得了真空回流焊接工艺的优化参数：焊接温度为340-350℃,保温时间约5-10 min,施加在每个焊接外壳上的压力约为60-80g.对封装外壳焊接质量进行了分析,并指出影响焊接质量的各种因数和获得良好焊接质量的方法.最后,将陶瓷外壳真空回流焊接工艺用于陀螺仪的真空封装,使陀螺仪的品质因子相对大气环境提高了15倍.The ceramic vacuum reflow packaging process is researched in the multifunction bonding equipment in this paper. The 80Au20Sn solder is selected to seal material, and its melting temperature is 283 ℃. The optimizing parameters of vacuum reflow process are obtained through many processing experiment, and the reflow temperature is 340-350 ℃, the maintaining high temperature time is 5-10 min utes, the applied force on each cover is 60-80 g. The sealing quality of vacuum packaging is analyzed, and all kinds of factors affecting sealing quality and method of obtaining fine sealing quality are presented. Finally, the ceramic packaging process is used to the MEMS gyroscope vacuum seal, and the testing result demonstrate that the gyroscope Q factor is improved 15 times than that of the gyroscope in the atmosphere environment.

关 键 词：MEMS 真空封装 陶瓷外壳 回流焊接工艺 

分 类 号：TN305.94[电子电信—物理电子学]