IC芯片粘片机并联机构焊头部件的设计及优化  

Design and Optimization on the Bonding Head with Parallel Structure in IC Die Bonder

作　　者：李克天[1] 陈新[1] 刘吉安[1] 范运谋[1] 

机构地区：[1]广东工业大学,广州510006

出　　处：《中国机械工程》2008年第10期1160-1162,共3页China Mechanical Engineering

基　　金：国家自然科学基金资助项目(50475044);教育部科学技术研究重点项目(2004106);高等学校博士学科点专项科研基金资助项目(20040562005);广东省自然科学基金资助项目(04300155;2005A1040304);广州市科技计划资助项目(2004Z3-D9021)

摘　　要：焊头是IC芯片粘片机重要的机械执行部件,提出一种采用并联机构的焊头结构,讨论了其结构原理并对其结构尺寸进行了优化。并联焊头结构的两个驱动电机均装配在机架上,不随焊头移动,执行机构重量轻;焊头由杆件呈三角状支撑,结构刚度大;通过两个电动机的联动控制,焊头能够完成吸拾芯片、传送芯片和粘焊芯片的功能。Bonding head is the key execute parts of the IC die bonder. The parallel bonding structure was proposed, and working principles and structure size optimization were discussed. Two driving motors of the bonding head were fixed in the rack and never move as the bonding head moves, so the weight of the executor is light. The bonding head standed as triangle style, so the rigidity of the structure is high. By controlling the two motors in the way of collaboration, the bonding head can fulfill the function of IC chip picking, transporting, and bonding, etc.

关 键 词：粘片机 并联机构 设计 优化 

分 类 号：TH112[机械工程—机械设计及理论]