一种MEMS热风速计的系统级封装  

A System-Level Package of MEMS Thermal Flow Sensor

作　　者：张骅[1] 沈广平[1] 吴剑[1] 秦明[1] 

机构地区：[1]东南大学MEMS教育部重点实验室,南京210096

出　　处：《传感技术学报》2008年第4期571-573,共3页Chinese Journal of Sensors and Actuators

基　　金：国家自然科学基金资助课题(64076019)

摘　　要：提出一种MEMS风速计的封装结构,采用这种结构可以集成信号处理电路,实现系统功能。利用ANSYS软件对封装结构进行建模,主要从风速和风向两个方面,对风速计封装前后的性能进行了模拟,并将模拟数据与理想数据和实验数据进行了比较,模拟数据、理想数据与理想数据的误差在7%以内。总体上,风速计在封装前后的性能大致相同,但是在灵敏度方面有所下降。The paper introduces a new packaging structure of a MEMS thermal flow sensor, which is able to realize the system function by integrating the signal processing circuit. Mainly concentrating on the flow speed and flow angle, the paper simulates the performance of the MEMS thermal flow sensor before and after packaging using ANSYS software. Furthermore, the paper compares the experimental data and the ideal data with the simulation data, and the error between them is within 7%. As a whole, the performance of the MEMS thermal flow sensor before and after packaging is similar, however, the sensitivity of the sensor is dramatically degraded.

关 键 词：MEMS 热风速计 封装 

分 类 号：TN492[电子电信—微电子学与固体电子学]