BGA焊球表面状态与微观结构关系的研究  

Relation between the Surface Condition and Microstructure of Solder Balls

作　　者：于洋[1] 史耀武[1] 夏志东[1] 雷永平[1] 郭福[1] 李晓延[1] 陈树君[1] 

机构地区：[1]北京工业大学,北京100022

出　　处：《稀有金属材料与工程》2008年第6期1092-1094,共3页Rare Metal Materials and Engineering

基　　金：国家"863"项目(2002AA322040);"十一五"项目(2006BAE03B02);北京市自然科学基金项目(012003);北京市属市管高等学校人才强教计划资助项目;2006高等学校博士学科点专项科研基金(20060005006)

摘　　要：焊球是球栅阵列封装(BGA)的主要连接部件,电子产品自动化生产要求焊球具有良好的表面光亮度。用均匀射流断裂方法生产BGA焊球,研究焊球内部显微结构,从焊球的微观结构推测钎料液滴的凝固行为。通过对小球光滑和粗糙部位微观结构分析,总结小球表面粗糙部位显微组织的特征。最后研究少量稀土元素对小球表面状态的影响。Solder ball is the main joining element of ball grid array packaging. The excellent surface of brightness and the reliability of contact points are required for the high degree of automation production. Lead-free solder balls are manufactured by a uniform droplet spray （UDS） method in this study. The solidification behavior of alloy droplet is explained from the microstructure of solder ball. By comparing the smooth and ragged portions, the microstructure characteristic of ragged portion is drawn. Finally, the effects of rare earth element on the microstructure and surface condition of Sn-3.8Ag-0.7Cu solder ball are studied.

关 键 词：微焊球 球栅阵列封装 固化行为 

分 类 号：TN304[电子电信—物理电子学]