活动屏蔽膜板高深宽比微细电铸技术研究  

Research on Micro Electroforming Technology of High-aspect-ratio Metal Microstructrues by Using a Movable Mask

作　　者：曾永彬[1] 朱荻[1] 曲宁松[1] 胡洋洋[1] 

机构地区：[1]南京航空航天大学,南京210016

出　　处：《中国机械工程》2008年第12期1457-1461,共5页China Mechanical Engineering

基　　金：国家自然科学基金资助项目(50635040);教育部博士学科点专项基金资助项目(20050287020)

摘　　要：针对金属微结构器件制造难的问题,提出了活动屏蔽膜板高深宽比微细电铸技术,通过屏蔽膜板动态地限制电沉积的区域,可以用低深宽比的膜板图形加工出高深宽比的金属微结构,并且免除了去胶等难题。在对活动屏蔽膜板微细电铸电场及传质进行分析的基础上,开展试验研究,获得了特征尺寸为500μm,深宽比分别为3和5的微静电梳状驱动器梳齿及微圆柱电极阵列。The objective of this paper is to develop a technology of micro electroforming for the fabrication metal microstructures. In the proposed technology, a movable mask with low--aspect-- ratio patterns was used to confine the area of electrodeposition dynamically in order to produce high-- aspect--ratio metal microstructures. The proposed technology offers some unique advantages over competing technologies such as avoiding removal of photoresist, no wear of mask. In this work, the mask was made by micro drilling and milling on an Epon board. The current distribution was analyzed using FEM method,mass transport in trench--like feature was also studied. The results indicate that as the deposit builds up to near the mouth of the trench, the uniformity gradually deteriorates due to the current crowding and spherical flux diffusion. Micro static electrical combs and array of micro EDM electrodes with aspect ratio of 3 and 5 respectively are obtained. The feature scale of the microstructures is 500μm.

关 键 词：微细加工 电铸 活动膜板 高深宽比 

分 类 号：TQ153.44[化学工程—电化学工业]