基于UV光照的圆片直接键合技术  

Wafer Direct Bonding Based on UV Exposure

作　　者：马沧海[1] 廖广兰[1] 史铁林[1] 汤自荣[1] 刘世元[1] 聂磊[1] 林晓辉[1] 

机构地区：[1]华中科技大学数字制造装备与技术国家重点实验室,武汉光电国家实验室武汉430074

出　　处：《Journal of Semiconductors》2008年第7期1369-1372,共4页半导体学报（英文版）

基　　金：国家重点基础研究发展规划(批准号:2003CB716207);国家自然科学基金(批准号:50405033;50775091);新世纪优秀人才支持计划(批准号:NCET-06-0639)资助项目~~

摘　　要：研究了UV辅助活化与湿化学清洗活化相结合的圆片直接键合技术,并利用红外测试系统、单轴拉伸测试仪和场发射扫描电子显微镜,结合恒温恒湿实验、高低温循环实验对键合质量进行了测试.结果表明,采用该技术可以实现较好的圆片直接键合,提高键合强度,控制合适的UV光照时间可以获得更高的强度,对键合硅片进行恒温恒湿和高低温交变循环处理后,硅片仍能保持较高的键合强度.因此,该工艺对于改进圆片直接键合技术是行之有效的,具有很大的应用潜力.Wafer direct bonding technology has extensive application and broad prospects. UV activation combined with wet chemical cleaning in wafer direct bonding is investigated. An IR detection system,single tensile machine,and FSEM are employed to evaluate the bonding quality. The constant temperature and humility experiment, and the high and low temperature cycle experiment are also performed. It has been demonstrated that this approach can realize wafer direct bonding and enhance the bonding strength. A higher strength can be obtained by controlling the UV exposure time. The bonded wafer treated by constant temperature and humility and high and low temperature cycle can retain a higher bonding strength. Therefore,the process is effective for the wafer direct bonding and has great potential for application.

关 键 词：圆片直接键合 紫外光照射 键合质量 可靠性 

分 类 号：TN305.2[电子电信—物理电子学]