微波裸芯片的测试技术  

The Testing Technology for Microwave Bare Die

作　　者：吴少芳[1] 孔学东[2] 黄云[2] 

机构地区：[1]广东工业大学,广东广州510075 [2]工业和信息化部电子第五研究所,广东广州510610

出　　处：《电子产品可靠性与环境试验》2008年第4期55-58,共4页Electronic Product Reliability and Environmental Testing

摘　　要：鉴于目前对微波裸芯片的旺盛需求,介绍了几种测试技术,主要包括探针台测试技术、夹具测试技术和非侵入式测试技术,并对不同的测试技术进行了对比,分析了各种测试方法的优缺点及存在的问题。The article mainly focuses on the testing technology for microwave bare dies, which are widely used currently. Three testing technologies are discussed in this paper, including probe test technology, carrier test technology and non-contacted test technology. At last, the advantages and disadvantages of various test methods are presented.

关 键 词：裸芯片 微波单片集成电路 夹具 探针 

分 类 号：TN454[电子电信—微电子学与固体电子学]