无铅焊料Sn-9Zn-xLa的制备及性能  

Preparation and Characteristic of Sn-9Zn-xLa Lead-free Solders

作　　者：王炜[1] 江素华[1] 戎瑞芬[1] 王珺[1] 汪荣昌[1] 顾志光[1] 

机构地区：[1]复旦大学材料科学系,上海200433

出　　处：《复旦学报（自然科学版）》2008年第3期403-407,共5页Journal of Fudan University：Natural Science

基　　金：国家自然科学基金资助项目(69836030-I)

摘　　要：采用粉末冶金技术成功制备了La含量为x（其中x=0．1％～0．5％）的无铅焊料Sn-9Zn—xLa，应用DTA，SEM，XRD等技术分析了焊料的熔点，形貌，微结构，成分，焊料与Cu基板的粘附性等性能，并获得这些性能随La添加量而变化的规律．研究表明：添加微量稀土元素La能较大程度的改善无铅焊料润湿等方面的性能，Sn-9Zn—xLa有望替代传统PbSn合金，成为微电子器件封装焊接材料．Sn-9Zn eutectic solder alloy is a potential candidate to replace 63Sn-37Pb alloy as interconnecting material in electronic packaging industry, But the inferior wettalility make this alloy not suitable for application widely. Sn-9Zn alloy added different La contents （0.1% -0.5 % ） were prepared by powder metallurgy, DTA, SEM and XRD were used to test and analyse performance of the solders accurately, Results show that the additional La in Sn-Zn-xLa solders would enhance the products performance in many aspects, such as melting point, wet tability, morpha and so on. Sn-Zn-x La may be a more appropriate candidate in industry.

关 键 词：无铅焊料 Sn-9Zn—xLa 润湿性 IMC 剪切强度 

分 类 号：TN306[电子电信—物理电子学]