一种用于微拉伸系统的MEMS弹簧设计与制作  

Fabrication of MEMS Springs for Micro-tensile System

作　　者：刘瑞[1] 汪红[1] 丁桂甫[1] 李雪萍[1] 杨春生[1] 

机构地区：[1]上海交通大学微纳科学技术研究院薄膜与微细技术教育部重点实验室微米/纳米加工技术国家级重点实验室,上海200030

出　　处：《微细加工技术》2008年第4期62-64,共3页Microfabrication Technology

基　　金：国家高技术研究发展计划(863)资助项目(2006AA4Z326)

摘　　要：针对微拉伸测试系统支撑梁因塑性变形带来的误差,采用UV-LIGA技术制备出S型支撑弹簧来代替刚性梁,这样即可测量大变形薄膜的力学性能。实验结果表明,用UV-LIGA工艺制备的Ni金属S形弹簧具有良好的均匀性,在较大的变形范围内有很好的线弹性。Micro-spring is the popular MEMS device in MEMS field. They could support the elastic force for micro-sensor and microactuator. The S-shape springs fabricated with U V-LIGA technology, and the S-shape spring could decrease the error coming from plastic yield of support springs were introduced. Moreover, S-shape springs were used in micro-tensile system which tests mechanical properties of thin film. The results show that S-shape spring of Ni metal is uniform and has good linear elastic ability in the large range deformation.

关 键 词：微弹簧 电铸 MEMS UV—LIGA 

分 类 号：TH135[机械工程—机械制造及自动化]