添加剂对脉冲酸性镀铜通孔均匀沉积的影响  

Effect of Different Additives on the uniform Deposition of through-hole by Pulse Electroplating in Acidic Copper Plating Bath

作　　者：王劭南[1] 王增林[2] 

机构地区：[1]应用表面与胶体化学教育部重点实验室,陕西西安710062 [2]陕西师范大学化学与材料科学学院,陕西西安710062

出　　处：《电镀与精饰》2008年第12期24-28,共5页Plating & Finishing

摘　　要：研究了在脉冲酸性电镀铜工艺中,不同相对分子质量的聚乙二醇及聚二硫二丙烷磺酸钠的质量浓度以及搅拌条件对微孔直径为300μm,深径比为7.3:1的通孔填充效果的影响。结果表明,随着聚乙二醇相对分子质量增大,通孔内壁铜沉积的均匀性逐渐增大,当聚乙二醇相对分子质量为8 000和12 000时,通孔的均匀度达到90%以上;当镀液中聚二硫二丙烷磺酸钠的质量浓度为4～6 mg/L、搅拌速率保持在700 r/min时,通孔内壁上可以镀覆一层均匀的铜导电层。The effect of the polyethylene glycol （PEG） molecular weight upon the uniformity of throughhole deposition was studied in acidic copper bath. The results showed that the uniformity of through-hole increases with the increase of the molecular weight of PEG, and the uniformity of through-hole can reach more than 90% when the molecular weight of PEG is 8 000 or 12 000. The effect of bis （3-sulfopropyl） disulfide （SPS） concentration and agitation rate upon the uniformity of through- hole deposition were also studied. When the agitation rate was 700 r/min and the concentration of SPS is in the range of 4.0 to 6. 0 mg/L, a uniform copper conducting layer could be obtained.

关 键 词：脉冲电镀 通孔 印刷电路板 添加剂 电镀铜 

分 类 号：TQ153.14[化学工程—电化学工业]