塑封微电路筛选鉴定和DPA技术的研究  

Research on the Screening Qualification and DPA Technology for Plastic Encapsulated Microcircuit

作　　者：林湘云[1] 来萍[1] 刘建[1] 李少平[1] 

机构地区：[1]信息产业部电子第五研究所电子元器件可靠性物理及其应用技术国家级重点实验室,广州510610

出　　处：《半导体技术》2008年第12期1108-1111,共4页Semiconductor Technology

摘　　要：由于塑封器件结构和材料等因素,存在非气密性、易受温度形变等特有潜在缺陷。有效的筛选和鉴定已经成为检验塑封微电路(PEMs)质量和提高应用可靠性的关键。DPA作为产品质量检验与可靠性评价技术,能提供PEM生产与设计、工艺和制造缺陷的信息。介绍了一套筛选、鉴定和DPA技术相结合的PEMs产品保证方法,可以作为向高可靠性要求用户提供高质量PEMs的主要评价手段。Many proper latent defects （eg. of their structure and material factors. Effective non-hermetic, thermalmechanical） exist in PEM because screening and qualification become the key for improving reliability and quality of PEMs. Being the quality and reliability evaluation technology, DPA can afford the information about the defects of PEM production, design and process. A system of product assurance （screening, qualification and DPA） for PEMs was introduced. It can be used for the major evaluating means to provide high-quality, high-reliability PEMs for users.

关 键 词：塑封微电路 缺陷 筛选 鉴定 破坏性物理分析 

分 类 号：TN306[电子电信—物理电子学]