电源工作模式对中频磁控溅射沉积速率的影响  

Effects of power supply mode on deposition rate in middle-frequency magnetron sputtering

作　　者：王军生[1] 童洪辉[1] 赵嘉学[1] 戴彬[1] 

机构地区：[1]核工业西南物理研究院,四川成都610041

出　　处：《真空》2009年第1期37-41,共5页Vacuum

基　　金：国家自然科学基金(10675044)

摘　　要：在中频孪生靶磁控溅射实验装置上,研究了电源恒压、恒流、恒功率工作模式下沉积速率与气压、电参数之间的关系,得出不同工作模式下电压、电流、功率及频率、占空比对沉积速率的影响:恒流模式下沉积速率稳定性最好,恒压最差;气压变化时,恒功率、恒流工作模式有稳定沉积速率作用;恒流模式下,沉积速率随占空比升高而减小,随频率升高而增大。On the experimental setup for middle-frequency twin-target magnetron sputtering process, the relationships between deposition rate, working gas pressure and electrical parameters were investigated under conditions of constant voltage/ current and sputtering power. Then the effects of voltage, current, power, duty ratio and frequency on the deposition rate in different power supply modes were thus given. The stabilization of deposition rate is best at constant current and worst under constant voltage, and is stable if the power and current are both constant but the pressure is changing. The deposition rate decreases with increasing duty ratio but increases with increasing frequency.

关 键 词：磁控溅射 电源工作模式 沉积速率 

分 类 号：TB43[一般工业技术]