美国高温微系统封装技术现状  

Overview of High Temperature Micro-System Packaging Technology in America

作　　者：陈岩[1] 郭宏[2] 李秀清[3] 

机构地区：[1]北京工商大学信息工程学院,北京100048 [2]天津大学,天津300072 [3]中国电子科技集团公司第十三研究所,石家庄050051

出　　处：《半导体技术》2009年第3期210-213,278,共5页Semiconductor Technology

摘　　要：到内太阳系执行各种空间探索研究任务离不开高性能的高温传感器与电子元器件;此外,宇航发动机环境也急需耐高温的燃烧/发射控制传感器与电子部件。在高温微器件与系统的开发中,封装技术至关重要。美国在该领域的研究一直处于世界领先水平。介绍了美国高温微系统封装技术的发展现状;以美国宇航局Glenn研究中心等研究机构的研发成果为重点,论述空间与航空应用领域急需的500℃以上高温恶劣环境工作的MEMS传感器封装技术,并从材料要求、技术水平和应用领域等方面展望了高温微器件封装技术的未来发展趋势。Sensors and electronics for space missions to inner solar system or combustion/emission control sensors/electronics located in an aeronautical engine environment are desirable. In the design and development of these high temperature devices and systems, packaging technology plays the most important role. America is in the frontier in this area, so a brief overview of the current high temperature micro-system packaging technologies in America is provided Centering by American research institutions such as NASA Glenn described for high temperature MEMS sensors over 500 ℃ on some of the research developments accomplished Research Center, the packaging approaches are that becomes ever compellingly necessary for both space and aeronautic applications. And finally, it takes an insight into the future development trends of high temperature micro-device packaging in terms of material requirements, technology capabilities and applications.

关 键 词：高温微系统 封装技术 宇航应用 微机械电子系统 传感器 碳化硅 

分 类 号：TN305.94[电子电信—物理电子学]