波峰焊接工艺技术的研究  

Study on Process of Wave Soldering

作　　者：鲜飞[1] 

机构地区：[1]烽火通信科技有限公司,湖北武汉430073

出　　处：《电子工业专用设备》2009年第2期10-14,共5页Equipment for Electronic Products Manufacturing

摘　　要：介绍了波峰焊接技术的原理,以及一种新型波峰焊接技术的特点,与传统波峰焊情况不同,它可以保护表面贴装元件来实现对通孔元件焊接。并分别从焊接前的质量控制、生产工艺材料及工艺参数方面探讨了提高波峰焊质量的有效方法。Wave soldering is a conventional soldering technology, now it still plays an important role in electronics production. The article introduces theory of wave soldering, at the same time an ad- vanced soldering technology is also mentioned, it allows through-hole components to be soldered, and protects SMT components from the wave, unlike in the case of wave soldering. At last the effective way for improving the quality of wave soldering dering and the control of manufacturing material is discussed in terms of the quality control before soland process parameters.

关 键 词：波峰焊 印制线路板 助焊剂 焊料 工艺参数 

分 类 号：TG453.9[金属学及工艺—焊接]