热超声倒装键合中温度对对准精度的影响  

Influence of Temperature on Alignment Accuracy in the Thermosonic Flip-chip Bonding

作　　者：张丽娜[1] 韩雷[1] 

机构地区：[1]中南大学现代复杂装备设计与极端制造教育部重点实验室,湖南长沙410083

出　　处：《计算机测量与控制》2009年第4期757-759,769,共4页Computer Measurement &Control

基　　金：国家自然科学基金(50575230;50675227);973项目(2003CB716202)

摘　　要：针对热超声倒装键合过程中芯片与基板的对准精度受温度影响,采用了6参数仿射模型分层搜索算法分别研究了温度影响下序列图像间平移、伸缩、旋转参数的分布规律;分析结果显示,随着温度的升高,湍流强度增强,图像间平移、伸缩、旋转运动越剧烈,对应参数的离散程度也越高;在键合温度下,伸缩与旋转对对准精度影响不大,可以忽略;平移最大可达6个像素,必须将平移量控制在亚像素级范围内才能满足芯片与基板的对准精度要求。As the temperature will effect the alignment accuracy of the chips and substrates in the process of chips package, the parameters distribution regulation of translation, scale and rotation of sequence images under the influence of the temperature are respectively studied by 6-parameter affine model hierarchical search algorithm. By Analysis of the experimental results, it indicated that the higher the temperature,the intensity of turbulence becomes bigger, and the motions of translation, scale and rotation more intensive and the dispersion degree of translation, scale and rotation are much higher. At the working temperature,the influence of scale and rotation to the alignment accuracy is very small,which can be neglected ;The translation can reach to 6 pixel,which must be controlled in the sub-pixel scope to meet the requirement of the alignment accuracy.

关 键 词：热超声倒装键合 仿射变换 分层搜索 清晰度评价函数 

分 类 号：TP391.41[自动化与计算机技术—计算机应用技术]