各类环境调和型封装技术与材料的现状  

Recent Situation of Various Environment Conscious Electronic Packaging Technology and Materials

作　　者：杨俊[1] 张颖一[1] 傅岳鹏[1] 田民波[1] 

机构地区：[1]清华大学材料科学与工程系,北京100084

出　　处：《半导体技术》2009年第4期301-306,共6页Semiconductor Technology

摘　　要：整理和归纳了各国不同的RoHS相关政策,并分门别类地概括和介绍了各种符合环保法规的封装技术和材料的发展与动态,包括电子元件的环境对应、环境调和型印制电路板技术、低温导电技术、导电性粘结剂、易解体电子产品、CO2减排技术等,并对封装材料日后的环境适应历程进行了预测。Different versions of RollS-related policies from different countries are collated and summed up, and the development on various kinds of packaging technology and materials are summarized based on environment conscience, including the environment corresponding of electronic components, the environment conscious printed circuit board technology, low-temperature conductivity technology, conductive adhesive, resoluble electronic products and earbon dioxide emission reduction technology. Finally, the future development of the environment conscious electronic package are pointed out.

关 键 词：电子封装 ROHS REACH 节能减排 环境调和 

分 类 号：TN305.97[电子电信—物理电子学]