一种新型微机械谐振式压力传感器研究  

Research of a Novel Micromachined Resonant Pressure Sensor

作　　者：史晓晶[1] 陈德勇[1] 王军波[1] 毋正伟[1] 刘磊[1] 

机构地区：[1]中国科学院电子学研究所传感器国家重点实验室,北京100190

出　　处：《传感技术学报》2009年第6期790-793,共4页Chinese Journal of Sensors and Actuators

基　　金：国家863计划项目资助(2007AA4Z318);国家自然科学基金NNSFC资助(60772018;60674112)

摘　　要：提出了一种微机械谐振式压力传感器的新结构。该传感器采用了电磁激励和差分检测方式。谐振器的制作采用了30μm厚扩散硅的(100)硅片,从而实现了谐振器与压力膜的一体化,避免了谐振梁与压力膜键合引入的应力,并且工艺简单易于实现。文中介绍了结构的有限元仿真(FEA-ANSYSSimulation)优化,工艺制作流程,及实验测试。在低真空下测试其品质因数(Q)高于10000,测量范围为0～100kPa,非线性度为0.62%,分辨率为1/10000,灵敏度为200Hz/kPa。A novel resonant pressure sensor structure is proposed. Electromagnetic excitation and differential detection are adopted. 30μm diffused （100） silicon is used for the resonator,thus the resonator and the pressure diaphragm can be fabricated on the same silicon substrate without bonding, which can avoid the stress from the bonding process. The theoretical analysis,FEA-ansys simulation, fabrication process, and the testing experiments are described. In the full scale 0-100 kPa, the experiments results show that the quality factor（Q） is better than 10 000 in low vacuum, the resolution is 1/10 000, the nonlinearity is 0. 62% , and the differential sensitivity is 200 Hz/kPa.

关 键 词：谐振式压力传感器 MEMS 电磁激励 差分检测 FEA-ANSYS 

分 类 号：TP212.1[自动化与计算机技术—检测技术与自动化装置]