无铅倒装焊点的热应力与湿热应力分析  

Analysis and Comparison of Thermal Stress and Hygrothermal Stress of Lead-free Flip Chip Solder Joint

作　　者：周祥 王应海 袁丽娟 李红益 王栋[2] 

机构地区：[1]苏州职业技术学院电子工程系,苏州215021 [2]中国电子科技集团公司第四十八研究所,长沙410111

出　　处：《电子与封装》2009年第7期8-12,共5页Electronics & Packaging

摘　　要：板上倒装芯片(FCOB)作为一种微电子封装结构形式得到了广泛的应用。微电子塑封器件中常用的聚合物因易于吸收周围环境中的湿气而对封装本身的可靠性带来很大影响。文章采用有限元软件分析了潮湿环境下板上倒装芯片下填充料在湿敏感元件实验标准MSL-1条件下(85℃/85%RH、168h)的潮湿扩散分布,进而分别模拟计算出无铅焊点的热应力与湿热应力,并加以分析比较。论文的研究成果不仅对于塑封电子元器件在潮湿环境中的使用具有一定的指导意义,而且对于FCOB器件在实际应用中的焊点可靠性问题具有一定的参考价值。Flip Chip on Board （FCOB） has been used widely as a microelectronics packaging structural form. The polymers commonly used in plastic electronic packaging are apt to absorb moisture in the environment, which greatly affects the reliability of packages.In this paper, moisture diffusion in the underfill of FCOB in moisture sensitive component test criterion MSL-1 （85 ~~/85%RH, 168h） by using FEA software is studied and modeled. Then, thermal stress and hygrothermal stress of lead-free solder joint are simulated and calculated separately, and their performances are analyzed and compared. The research results not only have some guidance signifcance to application of plastic encapsulated electronic components in humid environment, but also have some reference signifcance to the reliability of FCOB device solder joint in practical application.

关 键 词：板上倒装芯片 底充胶 无铅焊点 热应力 湿热应力 

分 类 号：TN305.94[电子电信—物理电子学]