基于复杂机电系统理论的全自动LED粘片机及其关键技术分析  

Analysis of Automatic LED Die Bonder and Its Key Technical Based on the Theory of Complex Electromechanical System

作　　者：吴小洪[1] 曹占伦[1] 姜永军[1] 林晓新[1] 

机构地区：[1]广东工业大学,广东广州510090

出　　处：《机电工程技术》2009年第8期84-86,137,共4页Mechanical & Electrical Engineering Technology

基　　金：国家自然科学基金(编号:50475044);广东省攻关计划项目(编号:2005A1040304);教育部科技研究重点项目(编号:2004106);高等学校博士学科点专项科研基金(编号:20040562005)

摘　　要：结合参与垂直式LED全自动粘片机开发的实际工作,以及复杂机电系统基本理论,分析了组成粘片机的进料装置、送料装置、收料装置、点浆机构、焊头机构、顶针装置、晶圆供送装置、视觉系统、控制系统等子系统的功能设计、特点和关键技术。详细分析了焊头机构及相关机构在固晶时的时序配合控制问题,并实现了物理样机,在工厂得到了实际应用。Involved in the development of vertical automatic LED Die Bonder,combined with the basic theory of complex electromechanical system,this paper described the function design,characteristics and the key technical of the automatic LED die bonder.Studied the components of the automatic die bonder,including the leadframe feeder,the leadframe transfer mechanism,the leadframe collector,the epoxyn dropping mechanism,the die bonding mechanism,the ejector,the chip feeding table,the machine vision and the motion control system.Detailedly analyzed the bonding head and the relevant mechanisms'cooperative control problem in time domain.And to achieve a physical prototype and several these machines are operating in the factory.

关 键 词：LED 粘片机 协同控制 

分 类 号：TN305[电子电信—物理电子学]