电子封装镀层锈蚀原因分析  

Cause analysis of corrosion of electroplated electronic packages

作　　者：张志谦[1] 刘圣迁[1] 

机构地区：[1]河北半导体研究所,河北石家庄050051

出　　处：《电镀与涂饰》2009年第9期16-19,共4页Electroplating & Finishing

摘　　要：介绍了一次电子封装外壳镀层出现锈蚀故障的处理过程。该外壳基材为4J42铁镍合金,其上镀镍再镀金,短期搁置后发现锈蚀。通过锈蚀过程和机理的分析,并经过试验验证,确定了锈蚀的原因是:包装用塑料膜受到氯化物的污染,导致镍镀层和铁镍合金基材在贮存过程中发生腐蚀。在此基础上,制定了相应的质量控制措施。The treatment process for corrosion of electroplated coatings on electronic packaging lid was introduced. The lid material is composed of 4J42 Fe-Ni alloy. Ni and Au coatings were electroplating successively on it. The corrosion was found after a short-term storage. The cause of corrosion was analyzed based on corrosion process and mechanism as confirmed by experiments. The contamination of plastic packaging film by chloride resulted in the corrosion of electrodeposited Ni coating and Fe-Ni alloy substrate during storage. Some corresponding measures for quality control were given.

关 键 词：集成电路封装 盖板 铁镍合金 镀镍 镀金 锈蚀 质量控制 

分 类 号：TQ153.1[化学工程—电化学工业] TG172[金属学及工艺—金属表面处理]