以均匀设计法对SCSP器件工艺参数的优化  

Optimization of the process parameters of SCSP device based on uniform design

作　　者：李功科[1] 秦连城[1] 牛利刚[1] 

机构地区：[1]桂林电子科技大学机电工程学院,广西桂林541004

出　　处：《电子元件与材料》2009年第10期62-65,共4页Electronic Components And Materials

基　　金：广西研究生教育创新计划资助项目(No.2008105950802M402)

摘　　要：利用有限元法研究了堆叠芯片封装(SCSP)器件在封装工艺过程中的热应力分布。将工艺过程中的固化温度、升温速率等工艺参数作为优化变量,采用均匀设计方法对其进行了优化组合,并为后续的回归分析产生样本点。通过回归分析得出工艺参数与最大等效应力之间的回归方程,并将回归方程作为优化算法近似的数学模型。结果表明:最大等效应力出现在EMC固化工艺中,所以在固化阶段SCSP器件容易产生可靠性问题。通过优化,最大等效应力由222.4MPa下降到了169.0MPa。The thermal stress distribution of SCSP in packaging process was studied by finite element method. The process parameters such as curing temperature and heating rate were considered as optimization variables. The combinations of process parameters were optimized by adopting the uniform design. Based on the regression analysis, the regression equation between the maximum equivalent stress and process parameters was obtained and used as an approximate mathematical model of optimization algorithm. The results show that the maximum equivalent stress occurs and reliability problems appear easily during EMC curing stage. The maximum equivalent stress is decreased from 222.4 MPa to 169.0 MPa after optimizing.

关 键 词：SCSP器件 封装工艺 均匀设计 热应力 

分 类 号：TN43[电子电信—微电子学与固体电子学]