三维封装中引线键合技术的实现与可靠性  

Implementation and Reliability of Wire-Bonding for 3-D Packages

作　　者：陆裕东[1,2] 何小琦[1] 恩云飞[1] 

机构地区：[1]信息产业部电子第五研究所,电子元器件可靠性物理及其应用技术国家级重点实验室,广州510610 [2]华南理工大学材料学院,特种功能材料教育部重点实验室,广州510640

出　　处：《微电子学》2009年第5期710-713,共4页Microelectronics

基　　金：中国博士后科学基金资助项目(20080430825);"十一五"预先研究项目(5132306);信息产业部电子第五研究所科技发展基金资助项目(XF0726130)

摘　　要：结合半导体封装的发展,研究了低线弧、叠层键合、引线上芯片、外悬芯片、长距离键合和双面键合6种引线互连封装技术;分析了各种引线键合的技术特点和可靠性。传统的引线键合技术通过不断地改进,成为三维高密度封装中的通用互连技术,新技术的出现随之会产生一些新的可靠性问题;同时,对相应的失效分析技术也提出了更高的要求。多种互连引线键合技术的综合应用,满足了半导体封装的发展需求;可靠性是技术应用后的首要技术问题。Based on existing packaging technologies, six wire-bonding interconnect technologies were studied, which include compress low loops, cascade bonding, chip on wire, bonding overhang die, bonded on both sides, and long in-board looping. Also, technological characteristics and reliability were analyzed. By persistent improvement, conventional wire-bonding has become a general interconnect technology in 3D packages. However, some unknown reliability issues arose from application of the improved technology. As a result, improvement should be made on failure analysis techniques for new bonding technologies. Several wire bonding technologies were used in combination to meet the requirement of developing semiconductor packaging. Reliability is the top priority issue after technology application.

关 键 词：引线键合 集成电路封装 可靠性 失效分析 

分 类 号：TN405.96[电子电信—微电子学与固体电子学] TN305.96