高导热金刚石/玻璃复合材料的制备和性能研究  

Preparation and properties of diamond/glass composite materials with high thermal conductivity

作　　者：童震松[1] 沈卓身[1] 张毓隽[1] 

机构地区：[1]北京科技大学材料科学与工程学院,北京100083

出　　处：《电子元件与材料》2009年第11期52-55,共4页Electronic Components And Materials

摘　　要：首先对金刚石颗粒进行化学镀Cu,并控制氧化,从而在金刚石颗粒表面获得Cu-Cu2O复合结构。然后,在800℃无压烧结制备了金刚石/玻璃复合材料,观察了其表面和界面形貌,并测定了其相对密度和热导率。结果表明,通过对镀Cu金刚石的控制氧化,明显改善了玻璃对金刚石颗粒表面的润湿性,避免了玻璃对金刚石颗粒表面的侵蚀,提高了复合材料的热导率;复合材料的热导率随金刚石含量的增加而增加,当金刚石质量分数为70%时,热导率最高达到了14.420W/(m·K)。Diamond particles were electroless plated with copper firstly. After a controlled oxidation process, the Cu-Cu20 structure formed on the surface of diamond particles. Then diamond/glass composite materials were prepared through pressureless sintering at 800 ℃. The surface and interface morphology of prepared composite materials were observed, and the relative density and thermal conductivity were measured. The results show that the controlled oxidation significantly improves the wettability while avoids the erosion of molten glass to the surface of diamond particles. Therefore, the thermal conductivity of the composite materials increases. The thermal conductivity of composite materials increases with increasing diamond content and reaches the maximum value of 14.420 W/（m· K） when the mass faction of diamond is 70%.

关 键 词：复合材料 金刚石 玻璃 热导率 化学镀铜 电子封装 

分 类 号：TG172.8[金属学及工艺—金属表面处理] TB33[金属学及工艺—金属学]