中温固化的金导电胶的研究  

Study On Gold Conductive Adhesive Curing In Mid Temperature

作　　者：李世鸿[1] 郎彩[1] 杜红云[1] 张樱[1] 

机构地区：[1]昆明贵金属研究所,650221

出　　处：《中国胶粘剂》1998年第5期1-3,共3页China Adhesives

摘　　要：一种金导电胶，由改性的酚类树脂（NF）、片状金粉与球状金粉的混合粉末、少量锑粉和醇类为主的溶剂组成，固化温度范围150－300℃，体积电阻率5×10(-4)Ω．cm，存放或可达半年以上，该导电胶可应用在二、三极管及组合电路中。The electroconductive adhesive is composed of modified phenol resin,mixture of platelet gold powder and sphericalgold powder, a small amount stibium powdr and alcohol solvent. Its curing temperature is in 150-300℃. Its bulk re-sishvity is about 5×10 -4 Ω. cm. The adhesive can be applied for die - bonding .

关 键 词：金导电胶 半导体 粘接 中温固化 胶粘剂 导电胶 

分 类 号：TQ437.6[化学工程]