互连宽度对铜互连应力可靠性的影响  

Effect of Line Width on Stress Reliability in Copper Interconnects

作　　者：侯通贤[1,2] 林晓玲[1,2] 姚若河[1] 

机构地区：[1]华南理工大学电子与信息学院,广州510640 [2]电子元器件可靠性物理及其应用技术国家重点实验室,广州510610

出　　处：《微电子学》2010年第1期122-125,共4页Microelectronics

基　　金：电子元器件可靠性物理及其应用技术国家重点实验室基金资助项目(9140C03010408DZ15)

摘　　要：基于Cu的随动强化模型,用二维有限元分析方法,模拟分析了不同互连宽度对Cu互连热应力分布的影响。研究发现,当互连尺寸减小到一定宽度后,静水应力先减小,后略有增加;随线宽的减小,等效塑性应变的最大值逐渐减小,塑性应变最大值的位置由Cu互连上界面处转向Cu互连上界面边角处,而发生等效塑性应变的区域先减小后增加。讨论了在不同Cu互连结构条件下,应力状态和塑性应变对Cu互连可靠性的影响。2-dimensional finite element analysis was used to analyze effect of different line widths on stress distribution with elastic-plastic model. It was found that, when the line geometry decreased to a certain width, hydrostatic stress firstly decreased and then increased a little. With decreasing line width, the maximum equivalent plastic strain gradually decreased and the location was turned from the upper interface to the comer of the upper interface in copper interconnects, while the area where equivalent plastic strain occured decreased and then increased. Effects of stress state and plastic strain on reliability of Cu interconnects in different Cu interconnect structures were discussed.

关 键 词：随动强化模型 铜互连 热应力 可靠性 

分 类 号：TN405.97[电子电信—微电子学与固体电子学]