UV-LIGA制作超高微细阵列电极技术  

Fabrication of ultra-high metal micro electrode array using UV-LIGA technology

作　　者：胡洋洋[1] 朱荻[1] 李寒松[1] 曲宁松[1] 曾永彬[1] 明平美[1] 

机构地区：[1]南京航空航天大学江苏省精密与微细制造技术重点实验室,江苏南京210016

出　　处：《光学精密工程》2010年第3期670-676,共7页Optics and Precision Engineering

基　　金：国家自然科学基金重点资助项目(No.50635040);江苏省自然科学基金资助项目(BK2007530);中国博士后科学基金特别资助项目(No.200801373)

摘　　要：采用UV-LIGA技术制作了超高金属微细阵列电极,并利用电解置桩的方法辅助去除SU-8胶。通过单次涂胶和提高前烘温度、降低后烘温度的方法制作了厚度达1mm的SU-8胶结构;采取反接电极法在金属基底上电解得到微坑,增强电铸金属电极与金属基底的结合力,保证去胶后电铸金属的完整性。选取优化的工艺参数:单次注射式涂胶,前烘110℃/12h,适量曝光剂量,分步后烘50℃/5min、70℃/10min、90℃/30min,反接电极电解10V/15min等,获得了高900μm、线宽300μm的金属微细阵列电极结构。试验表明,UV-LIGA技术是一种高效、经济的制造超高微细阵列电极的有效手段。UV-LIGA technology was investigated to fabricate the ultra-high micro electrode array, and the micro electrochemical machining was used as an aided method to remove the SU-8 resist. During the lithography process,a SUZ8 mold up to 1 mm thick was fabricated on the substrate by methods of single coating,increasing soft bake temperature and decreasing post bake temperature. Before the electroforming process, a reverse polarity procedure was carried out to make the micro roots on the substrate, which could enhance the adhesion of the electroformed micro copper electrode arrayto the substrate. Using the optimized parameters： single coatings soft bake 110 ℃/12 h; post bake 50 ℃/5 min, 70 ℃/10 min, 90 ℃/30 mini electrochemcial machining 10 V/15 min et al. , the micro electrode arrays with a heigh of 900 μm and a linewidth of 300 μm were fabricated, The result indicates that UV-LIGA is an excellent method for fabricating ultra-high metal micro electrode arrays.

关 键 词：UV-LIGA SU-8胶 电解 去胶 微细阵列电极 

分 类 号：TN305.7[电子电信—物理电子学] TG662[金属学及工艺—金属切削加工及机床]