挠性覆铜板用无卤阻燃环氧树脂及其固化剂的研究进展  

Progress in Halogen-free Flame Retardant Epoxy Resins and Its Curing Agents for Flexible Copper Clad Laminate

作　　者：刘刚[1] 李桢林[1,2] 严辉[1,2] 杨蓓[1,2] 范和平[1,2] 

机构地区：[1]湖北省化学研究院,湖北武汉430074 [2]华烁科技股份有限公司,湖北武汉430074

出　　处：《化学与粘合》2010年第2期50-55,58,共7页Chemistry and Adhesion

摘　　要：为了适应无卤无铅绿色环保发展要求,挠性覆铜板(FCCL)的环保性能越来越受到大家的重视。目前FCCL最常用的材料为环氧树脂胶黏剂,虽然添加型阻燃剂能达到阻燃效果,但是对力学性能影响很大。所以,反应型的环氧树脂及其固化剂的无卤化是FCCL无卤化的两个重要方面。综述了近年来国内外在无卤阻燃环氧树脂(含磷、含硅、含氮环氧树脂及苯酚-芳烷基型自熄性环氧树脂)及其固化剂(含磷、含硅固化剂,含氮酚醛树脂和苯酚-芳烷基型环氧树脂固化剂)的研究进展,并对其今后的发展做一展望。In order to adapt to the trend of ＂lead-free＂ and ＂halogen-free＂ green environmental demand,environmental performance of flexible copper clad laminate （FCCL） attracts more attentions. Epoxy resin adhesive is the most common material in FCCL,although the additive type flame retardant can achieve the same results,but it has a great influence on the mechanical properties. Therefore,non-halogenated epoxy resin and curing agent are two important aspects for halogen-free FCCL. The progress in study at home and abroad in recent years on halogen-free flame retardant epoxy resin （phosphorus, nitrogen and silicon contained epoxy resin and phenol-aralkyl self-extinguishing epoxy resin） and curing agent （phosphorus and silicon contained curing agent, nitrogen contained phenolic resin and phenol-aralkyl curing agent） are reviewed as well as its future development.

关 键 词：挠性覆铜板 无卤 阻燃 环氧树脂 固化剂 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]