纳米压印光刻中抗蚀剂膜厚控制研究  

Film thickness control of resist on nanoimprint lithography

作　　者：严乐[1] 李寒松[2] 刘红忠[3] 卢秉恒[3] 

机构地区：[1]北京信息科技大学机电工程学院,北京100192 [2]南京航空航天大学机电学院,南京210016 [3]西安交通大学机械制造系统工程国家重点实验室,西安710049

出　　处：《机械设计与制造》2010年第4期201-203,共3页Machinery Design & Manufacture

摘　　要：研究了纳米压印光刻匀胶工艺中抗蚀剂膜厚与抗蚀剂粘度、匀胶转速、匀胶时间和滴胶量之间的关系。实验研究表明,抗蚀剂膜厚与抗蚀剂粘度、匀胶转速和匀胶时间均呈幂指数关系;当匀胶转速达到一定值,匀胶时间足够大时,膜厚不再随匀胶时间变化而变化,存在最小厚度,即抗蚀剂膜厚与滴胶量无关。建立了抗蚀剂膜厚与抗蚀剂粘度、匀胶转速和匀胶时间之间的量化关系公式,实现了对抗蚀剂膜厚的控制。The relationship between the film thickness of polymer resist and the viscosity of polymer resist,the spin speed,spin coating time and dispensed polymer resist volume is studied for spin coating process on nanoimprint lithography. The experiments show that the relationship between them can be expressed as a power fimction,and there is no relationship between the film thickness and the dispensed polymer resist volume if the spin speed and spin coating time are comparatively high enough,the film thickness will not change and the minimum film thickness is obtained. The quantitative relationship between the polymer resist＇s film thickness and the viscosity of polymer resist,the spin speed,spin coating time is established. Hence,the film thickness control is realized.

关 键 词：纳米压印光刻 抗蚀剂 匀胶 膜厚控制 

分 类 号：TH112[机械工程—机械设计及理论] TH113.1