基于微机电系统技术的微型热电致冷器研究进展  

Latest Development of Micro Thermoelectric Cooler Based on MEMS

作　　者：任大海[1,2] 卢凯[1] 戴震宇[1] 尤政[1,2] 

机构地区：[1]清华大学精密仪器与机械学系,北京100084 [2]清华大学精密测试技术及仪器国家重点实验室,北京100084

出　　处：《机械工程学报》2010年第8期114-120,共7页Journal of Mechanical Engineering

摘　　要：介绍热电材料、热电器件的原理及发展历史,从材料及结构两方面,对基于微机电系统加工工艺的微型热电致冷器的最新研究进展进行综述,比较不同材料及不同结构的性能特点,对块体热电材料和低维热电材料的研究进展进行介绍,着重分析超晶格薄膜材料及Cross-Plane型器件,指出研究具有更高优值系数的新型材料,在维持Seebeck系数不变的同时提高电导率并降低热导率,及采用新的加工工艺优化致冷器的结构,减小接触电阻、接触热阻等,是提高热电致冷器性能的有效手段。Basic principles and the history of thermoelectric materials and devices are introduced.Latest development of MEMS based micro thermoelectric coolers is summarized.Different thermoelectric materials and different cooler structures are analyzed and compared.Also the latest progress of bulk materials and low-dimensional thermoelectric materials are introduced,in which superlattice film materials and Cross-Plane devices are analyzed in detail.Several approaches to improve the performance of the thermoelectric cooler are presented,including the development of new materials with higher figure of merit value,enhancing the electrical conductivity and decreasing the thermal conductivity when maintaining a constant Seebeck coefficient,and the optimization of cooler structures by using new fabrication techniques to reduce thermal and electrical contact resistance.

关 键 词：微机电系统 热电 致冷器 超晶格薄膜 

分 类 号：TB61[一般工业技术—制冷工程]