0.35μm投影光刻机的逐场调平技术与套刻步进模型  

Field-by-Field Leveling Techniques and Overlapping Stepping Model for0 .35μm Projection Stepper

作　　者：胡淞[1] 姚汉民[1] 张津[1] 李展[1] 曾晓阳 苏伟军[1] 

机构地区：[1]中国科学院光电技术研究所,成都610209

出　　处：《光电工程》1998年第A12期42-46,共5页Opto-Electronic Engineering

摘　　要：介绍用于 0 .35μm投影光刻机的逐场调平技术 ,讨论其检测和控制原理 ,并作精度分析 ;讨论逐场调平对套刻精度的影响 ,并建立三轴测量逐场调平的套刻步进模型。The field- by- field leveling techniques used for 0 .35μm projection stepper is described in the paper.Its testing and control principles are discussed,and the accuracy analysis is carried out.The effect of field- by- field leveling on overlapping accuracy is discussed.An overlapping stepping model for three- axis measurement and field- by- field leveling is set up.

关 键 词：投影光刻机 逐场调平 步进模型 IC 

分 类 号：TN405.7[电子电信—微电子学与固体电子学]