BGA焊点可靠性工艺研究  

Process Research on Reliability of BGA Solder Joint

作　　者：巫建华[1] 

机构地区：[1]中国电子科技集团公司第43研究所,合肥230022

出　　处：《电子与封装》2010年第5期7-10,29,共5页Electronics & Packaging

摘　　要：伴随高密度电子组装技术的发展,BGA(Ball Grid Array)成为高密度、高性能、多功能及高I/O数封装的最佳选择。文章分析了影响BGA焊点可靠性的关键因素,特别提出了减少焊点空洞缺陷和提高剪切强度的主要措施,并通过试验优化出各工艺参数。结果表明:运用优化的工艺参数制作的BGA焊点,焊接空洞以及芯片剪切强度有了明显改善,其中对BGA焊接样品进行150℃、1000h的高温贮存后,焊点的剪切强度完全满足GJB548B-2005的要求。With the development on electronic packaging technology of high density, BGA will be the best choice of high density, high performance, multiple functions and high I/Os. This paper analyzes the critical factors on reliability of BGA solder joint, especially presents critical solutions how to decrease void defect and increase shear strength of solder joint and optimizes process parameters through test. The results show solder void and shear strength of BGA solder joint are apparently improved using optimizing process parameters. After 150℃, 1000h high temperature storage, shear strength of solder joint can meet the requirement of GJB548B-2005.

关 键 词：焊球阵列封装 焊点 空洞 剪切强度 

分 类 号：TN305.94[电子电信—物理电子学]