倒杯式耐高温高频响压阻式压力传感器  

Inverted-Cup High-Temperature and High-Frequency Piezoresistive Pressure Sensor

作　　者：赵立波[1,2] 赵玉龙[1] 李建波[1] 梁建强[1] 李勇[2] 蒋庄德[1] 

机构地区：[1]西安交通大学机械制造系统工程国家重点实验室,西安710049 [2]清华大学摩擦学国家重点实验室,北京100084

出　　处：《西安交通大学学报》2010年第7期50-54,共5页Journal of Xi'an Jiaotong University

基　　金：国家自然科学基金资助项目(50836004;50905139);西安交通大学机械制造系统工程国家重点实验室开放基金和机械工程学院青年教师基金资助项目

摘　　要：采用微型机械电子系统(MEMS)技术制作出了高精度、高灵敏度的硅隔离(SOI)倒杯式耐高温压阻力敏芯片,利用静电键合工艺将力敏芯片封装到玻璃环上,再通过玻璃浆料烧结工艺或高温胶黏剂将玻璃环装配到齐平式机械结构上,从而避免了管腔效应的影响,实现了耐高温高频响压阻式压力传感器的基本制作.通过有限元仿真和实验,分析了安装预紧力对传感器性能的影响,由传感器静态和动态实验得到传感器的精确度为±0.114%FS,动态响应频率为694.4kHz,均满足火工品爆破测试等高温高频动态压力测试的要求.Silicon-on-insulator （SOI） inverted-cup high-temperature piezoresistive pressure sensitive chip with high accuracy and sensitivity was developed by micro electro-mechanical system （MEMS ） technology. It was bonded on glass ring with electrostatic bonding technology and the glass ring was packaged on the flush-type mechanical structure with glass slurry sintering process or high temperature adhesive technology. The channelling effect was avoided due to the flush-type mechanical structure and the packaging technique,so the inverted-cup high-temperature and high-frequency piezoresistive pressure sensor was fabricated basically. The effect of installation pre-tightening force on the sensor properties was analyzed with finite element method （FEM） and the experiments. The static and dynamic experiment results show that the accuracy of the sensor gets ±0.114% FS and the dynamic response frequency 694.4 kHz,which develops the sensor to meet the measurement requirements of high-temperature and high-frequency dynamic pressure in the fields like explosive blasting test.

关 键 词：微型机械电子系统 硅隔离倒杯式压阻力敏芯片 齐平式 预紧力 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置]