铜箔表面电镀铜粗化工艺  

Copper Electroplating Technology for Roughening of Copper Foll

作　　者：冯绍彬[1] 李振兴[1] 胡芳红[1] 孙亮[1] 韦永雁[1] 

机构地区：[1]郑州轻工业学院材料与化工学院河南省表界面科学重点实验室,河南郑州450002

出　　处：《材料保护》2010年第7期24-26,共3页Materials Protection

基　　金：国家自然科学基金(No.20576126)资助

摘　　要：国产铜箔表面粗糙度不够,直接影响镀镍层的形态,用作高分子温度系数热敏电阻时与高分子聚合物的结合强度不够,致使其使用性能不达标。为了提高铜箔与有机材料间的结合强度,常采用表面粗化工艺。采用酸性硫酸盐镀铜工艺对铜箔表面进行粗化,并用微分电容曲线的电化学测量和扫描电镜及金相显微镜表征了铜箔粗糙度。结果表明,粗化电流密度为20A/dm2时,粗化效果最为明显,在抗拉端面面积相同的情况下,国产铜箔抗拉强度由粗化前的60.85N/cm2增大到粗化后的137.81N/cm2,接近国外商品铜箔的抗拉强度138.26N/cm2。Copper electroplating process in acidic sulfate bath was used to roughen the surface of copper foil. The surface roughness of the Cu foils before and after roughening was measured by using differential capacity curves as well as scanning electron microscopic and metallurgical microscopic observation. Results indicate that the best roughening efficacy is obtained at a roughening current of 20 A/dm2. After roughening process, the tensile strength of domestic copper foils was increased from 60. 85 N/cm to 137. 81 N/cm2, which was comparable to that of exported copper foils (138.26 N/cm2).

关 键 词：表面粗化 电镀铜 微分电容 扫描电镜 抗拉强度 

分 类 号：TQ153.1[化学工程—电化学工业]