一种采用AuSn合金焊料封盖的陶瓷外壳平行缝焊工艺研究  

The Reserch of A Kind of Ceramic Shell Prallel Seam Welding Process Using AuSn AHoy Solder Sealing Technology

作　　者：王飞[1] 

机构地区：[1]中国电子科技集团公司第43研究所,合肥230022

出　　处：《混合微电子技术》2010年第2期45-49,共5页Hybrid Microelectronics Technology

摘　　要：本文介绍了一种基于平行缝焊工艺采用AuSn合金焊料对陶瓷外壳进行封盖的工艺方法，通过对平行缝焊工艺的研究，解决了该类外壳的气密性与外观质量要求，找到了一种有效解决陶瓷外壳封盖的新方法。The paper introduces aparallel seam welding process based on AuSn alloy solder used to seal the ceramic case process method. By investigating prarllel seam sealing process, prolems associated with hermetieity and appearance quality of the device are solved and an effective solvtion is found to corer the new- method of ceramic case.

关 键 词：平行缝焊 陶瓷外壳 AuSn合金焊料 

分 类 号：TG44[金属学及工艺—焊接]