一种齐平封装的MEMS高频响压力传感器  

A Flush-Type Package MEMS Piezoresistive Pressure Sensor with High Frequency Response

作　　者：李建波[1] 赵玉龙[1] 赵立波[1] 

机构地区：[1]西安交通大学机械制造系统工程国家重点实验室,陕西西安710049

出　　处：《测试技术学报》2010年第5期467-470,共4页Journal of Test and Measurement Technology

基　　金：国防基础科研资助项目(B1420080211-08)

摘　　要：设计了一种耐高温、高频响压力传感器芯片,解决了军事爆破工程实际中需要在高温环境中不失真地测量一些变化频率高、压力波形上升快陡的动态压力.基于硅隔离SOI(绝缘体上的硅)技术和MEMS(微型机械电子系统)技术,利用ANSYS对它们进行了量程和固有频率的模拟,并分析计算了加速度灵敏度.对它们进行了齐平结构的封装,避免了管腔效应的影响,得到了一种耐高温、高频响的压力传感器.对其中1 MPa量程的压力传感器进行了动态标定,通过激波管的试验,得到1 MPa压力传感器的响应频率为147 kHz,满足工程实际中的应用.This paper presents a high temperature, high frequency piezoresistive pressure sensor, solving the measurement of dynamic pressure waveform under the conditions of high natural frequency and short rise time in the explosion and engineering practice. It bases on SOI （Silicon on Insulator） technology and MEMS （Micro-Electro-Mechanical systems） technology. We simulated its measuring range and natural frequency by finite element analysis software ANSYS,and analyzed the acceleration sensitivity. According to the design of flush--type mechanical structure and packaging technique, the channeling effect can be avoided. The dynamic calibration of the sensor has been tested, and the response frequency of the sensor with the range 1 MPa is 147 kHz through the shock tube experiments, which could satisfy the need of practical engineering application.

关 键 词：MEMS 耐高温 SOI 高频响 压力传感器 齐平封装 

分 类 号：TP212.12[自动化与计算机技术—检测技术与自动化装置]