焊盘尺寸对PBGA组装板可靠性的影响  

Effect of Pad Diameter on Reliability of PBGA Assemblies

作　　者：吴懿平[1] 张乐福[1] 崔昆[1] 

机构地区：[1]华中理工大学材料学院

出　　处：《电子工艺技术》1999年第4期153-156,共4页Electronics Process Technology

摘　　要：研究了焊盘尺寸对氮气再流焊ＰＢＧＡ组装板可靠性的影响。氮气保护再流焊炉内的氧含量可低至５×１０－５。对ＰＢＧＡ组装板的焊点进行了拉伸试验、弯曲疲劳试验以及热冲击疲劳试验。结果表明：经氮气保护再流焊组装的ＰＢＧＡ板其焊点的各项性能均比无保护的ＰＢＧＡ组装板好。当ＰＣＢ板焊盘直径等于ＰＢＧＡ基底焊盘直径时，其焊点有最好的性能。In this work, the effect of pad diameter on the reliability of plastic ball grid array assemblies (PBGA) reflow soldered in a nitrogen ambient with oxygen content down to 510-5 was studied. Some experiments such as shear tensile testing, bending fatigue testing, thermal shock testing were performed on PBGA assemblies. The results showed that the reliability of PBGA assemblies reflowed in a nitrogen ambient are better than in a compressed air ambient. The mechanical properties of the PBGA assemblies are found to be best when pad diameter of PCB is close to that of BT substrate.

关 键 词：PBGA 可靠性 再流焊 组装板 IC 

分 类 号：TN405[电子电信—微电子学与固体电子学] TN406