对流—扩散传质对微电铸镀层均匀性的影响  

Effect of convective-diffusive mass transfer on coating uniformity electroforming

作　　者：陈晖[1] 李光杨[1] 汪红[1] 王艳[1] 丁桂甫[1] 赵小林[1] 

机构地区：[1]上海交通大学微纳科学技术研究院微米/纳米加工技术国家重点实验室薄膜与微细技术教育部重点实验室,上海200240

出　　处：《传感器与微系统》2010年第8期41-43,47,共4页Transducer and Microsystem Technologies

基　　金：上海市科委科研计划资助项目(0852nm02600);国家重点实验室基金资助项目(9140C79030302090C79)

摘　　要：利用有限元分析软件FLUENT对MEMS微电铸镀层均匀性进行了分析。对当物质传输成为金属沉积的控制步骤时,进行对流—扩散传质过程数值模拟,研究不同深宽比微结构中对流—扩散对传质的影响。模拟结果表明:当对流—扩散传质成为控制步骤时,渗透流影响镀层基本形貌,回流会引起镀层形貌的微小起伏。MEMS micro-electroforming uniformity are analyzed using FLUENT softwary. The convective-diffusive mass transfer effects inside different high-aspect-ratio micro-structures are simulated when the mass transfer turns into the control step. The results of simulations show that when the mass transport is controlled mainly by convection and diffusion, the penetration flow within the cavity effects the bump shapes and the vortices flow effects the minor ups and downs.

关 键 词：微电铸 对流-扩散传质 渗透流 回流 

分 类 号：TQ153[化学工程—电化学工业]