MEMS器件真空封装工艺研究  

Vacuum Packaging Technologies Research of MEMS Devices

作　　者：杨凯骏[1] 王学军[1] 井文丽[1] 张建宏[1] 王宁[1] 

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030024

出　　处：《电子工业专用设备》2010年第10期5-7,25,共4页Equipment for Electronic Products Manufacturing

摘　　要：MEMS器件的真空封装是整个工艺过程中的难点,封装的质量决定着整个器件的质量和使用寿命。现有的封装工艺,封装后器件内部真空度不能有效保持,是需要在真空下工作的器件的瓶颈。随着吸气剂的广泛使用,使MEMS器件的真空度保持能力大大提高,但现有的封装工艺设备不能满足吸气剂的激活条件。分析了空气阻尼对MEMS器件品质因数的影响,提出一种将现有的真空共晶设备的改进方法,使之能应用于使用吸气剂的MEMS器件的真空封装工艺。Vacuum packaging technologies of MEMS devices are the difficulty in the whole packaging process and the packaging quality determines the quality and service life of the whole devices.For the existing packaging technology,vacuum degree inside device can＇t be kept effectively after packaging,which is the bottle neck that needs to work in the vacuum.With the getter is used widely,vacuum maintaining ability of MEMS is also improved greatly,but the existing packaging equipment can＇t meet activated condition of the getter.In this paper,Author analyzed air damping＇s influence on MEMS quality factor,and proposed an improvement method for existing vacuum brazing equipment,which can be applied to vacuum packaging technology of MEMS of using the getter.

关 键 词：MEMS器件 真空封装 吸气剂 品质因数 

分 类 号：TN405[电子电信—微电子学与固体电子学]