一种考虑温度时间—空间分布的解析互连延时模型  

An analytical interconnect delay model with temperature time-space distribution

作　　者：董刚[1] 冷鹏[1] 柴常春[1] 杨银堂[1] 

机构地区：[1]西安电子科技大学微电子所宽禁带半导体材料与器件教育部重点实验室,陕西西安710071

出　　处：《电路与系统学报》2010年第6期1-5,共5页Journal of Circuits and Systems

基　　金：国家自然科学基金(60606006);国家杰出青年基金(60725415);西安电子科技大学基本科研业务费资助项目

摘　　要：本文从热扩散方程出发,得到了互连温度时间—空间分布的解析表达式。考虑互连温度对互连电阻和Elmore延时的影响,同时提出了一种用以分析互连时间—空间温度分布效应对互连延时影响的等效内阻模型。基于所提出的模型,详细地分析了互连长度、输入信号频率和功率对互连延时的影响。所提出的互连温度分布和延时解析模型可以应用于深亚微米温度相关的互连性能分析中。In this paper, starting from the heat diffusion equation, an analytical expression of interconnect temperature time-space distribution is derived. Considering the impacts of temperature on the interconnect resistance and Elrnore delay, the equivalent inner resistance model is also developed to analyze interconnect delay with temperature time-space distribution. Based on the proposed model, interconnect length, frequency and power of input signal, which have effects on the interconnect delay, are discussed in detail. Both of interconnect temperature distribution and delay models can be applied to the interconnect performance analysis in DSM regime.

关 键 词：互连 温度 时空分布 延时 

分 类 号：TN405.97[电子电信—微电子学与固体电子学]