凸台式PIN二极管失效分析和键合工艺改进  

Failure Analysis and Wire Bonding Improvement of PIN Diode with a Convex Plate

作　　者：肖诗满[1] 李少平[1] 

机构地区：[1]工业和信息化部电子第五研究所,广州510610

出　　处：《电子与封装》2010年第12期5-7,11,共4页Electronics & Packaging

摘　　要：PIN二极管在封装、试验过程中分别出现大量的失效,分析发现,这种PIN二极管考虑到频率和寄生电容的要求,采用一种"凸台"式结构,即结区和阳极在一个突出的凸台上,凸台直径仅有28μm。这种凸台边缘只要受到一个较小的机械应力的作用,就会造成凸台崩损、结被破坏,导致结漏电或在小电压下击穿。因此凸台对键合时产生的机械应力很敏感,普通的芯片键合技术也会对凸台造成机械损伤,严重影响器件良品率和长期可靠性。通过对劈刀的改进和重新选择键合丝以及精心调试的键合参数,有效防止了键合对二极管造成的损伤,提高了二极管的成品率和可靠性。The PIN diodes failed after they were packaged or being tested.It was found that the PIN was a convex plate,and the anode was higher than the cathode silicon,which was only 28μm and was quite different from other devices.The problem was：the convex plate would be hurt by little mechanical stress,and the diode would be breakdown or bringing leakage current.So the wire bonding was difficult.The normal bonding technology will introduce mechanical damage to the anode and the yield rate and reliability decreased.The shape of the capillary tip,the diameter of the gold wire,and debugging options were reseted,and then the mechanical damage was cut down.The yield rate and reliability was improved too.

关 键 词：PIN二极管 失效分析 键合 

分 类 号：TN305.94[电子电信—物理电子学]