AlSiC电子封装材料的凝胶注模法制备  

Preparation of AlSiC electronic package materials by gel-casting

作　　者：吴金方[1] 刘君武[1] 丁锋[1] 李青鑫[1] 郑治祥[1] 

机构地区：[1]合肥工业大学材料科学与工程学院,安徽合肥230009

出　　处：《合肥工业大学学报（自然科学版）》2011年第3期336-340,共5页Journal of Hefei University of Technology：Natural Science

基　　金：安徽省自然科学基金资助项目(090414187);合肥工业大学博士专项基金资助项目(GDBJ2008-018)

摘　　要：文章将凝胶注模技术与铝合金无压熔渗技术相结合,采用3种颗粒级配填隙制备出SiC体积分数大于60%的AlSiC复合材料。研究结果表明,凝胶注模制备的SiC预制件粗细颗粒分布均匀;含粗颗粒SiC浆料中引入质量分数约为2%的高温黏结剂,在1 050℃煅烧1 h即可使预制件具有满足后续工艺要求的强度,而且整个过程中坯体尺寸稳定;AlSiC复合材料抗弯强度大于270 MPa,室温热扩散率为0.75 cm2/s,热导率为175 W/(m.K),室温至250℃的平均线热膨胀系数为5.9×10-6K-1,完全满足电子封装技术的要求。AlSiC composites with the SiC volume fraction of over 60% were prepared by pressureless infiltration of liquid aluminum alloy into SiC preforms produced by gebcasting from mixture of three particle sizes of SiC powder. The results show that coarse or fine SiC particles distribute evenly in SiC preforms produced by gel-casting methods. When the high temperature binder whose mass fraction is about 2% is introduced into the slurry with coarse SiC particles, SiC preforms have enough strength to suffice subsequent process demand as sintered at 1 050 ℃ for 1 h, and the dimensions of SiC preforms are stable during the whole production process. The flexural strength of A1SiC composites is beyond 270 MPa, the coefficient of thermal diffusion is 0. 75 cm2/s and the thermal conductivity is 175 W/（m · K） at room temperature. The mean coefficient of linear thermal expansion between room temperature and 250 ℃ is about 5.9× 10^-6 K^-1, which meets well the demand of electronic package technology.

关 键 词：AlSiC 凝胶注模 无压熔渗 电子封装 

分 类 号：TB331[一般工业技术—材料科学与工程]