SiC/Cu-Al复合材料无压浸渍制备工艺的研究  

Study on preparation technique of SiC/Cu-Al composite by pressureless infiltration

作　　者：杜双明[1] 胡丞[1] 王明静[1] 赵维涛[1] 

机构地区：[1]西安科技大学材料科学与工程学院,陕西西安710054

出　　处：《电子元件与材料》2011年第5期38-41,共4页Electronic Components And Materials

基　　金：西安科技大学科研创新基金项目资助(No.200637)

摘　　要：利用化学镀法在SiC颗粒表面包覆Cu层制备了SiC/Cu复合粉体,然后将其压制成预制体并在熔融铝液中无压浸渍,制出了SiC/Cu-Al复合材料。研究了浸渍温度和时间对所制SiC/Cu-Al复合材料浸渍效果的影响。结果表明:SiC颗粒表面的Cu包覆层分布均匀;在800℃、保温2 h条件下制备的SiC/Cu-Al复合材料显微组织致密;在700～900℃的浸渍温度范围内,铝的浸渍深度随着浸渍温度的升高先增加后减小;随着浸渍时间的延长,复合材料的显微组织越来越致密;Cu包覆层有效地改善了SiC颗粒与铝熔体间的润湿性,抑制了Al4C3脆性相的生成。SiC/Cu composite powders were prepared by coating SiC particles with Cu using the chemical plating method.SiC/Cu-Al composite was then prepared by soaking the preform made from SiC/Cu composite powders in molten aluminum under argon gas and 1 atm.The effects of soaking temperature and time on the infiltration depth of Al and microstructure of SiC/Cu-Al composite were studied.The results show that： For SiC/Cu composite powders,Cu particles uniformly distribute on the surface of SiC particles;The SiC/Cu-Al composite prepared by 2 h soaking at 800 ℃ shows a compact microstructure;When soaking temperature is in the range of 700-900 ℃,the infiltration depth of Al in the composite increases first and then decreases with increasing soaking temperature;The compactness of the microstructure of SiC/Cu-Al composite increases with increasing soaking time;Cu coating effectively improves the wettability between SiC particles and molten aluminum,and inhibits the formation of Al4C3 brittle phase.

关 键 词：化学镀铜 SiC/Cu复合粉体 无压浸渍 SiC/Cu-Al复合材料 

分 类 号：TM28[一般工业技术—材料科学与工程]