基于LTCC基板微波互连技术的探究  

A Study of Interconnection Technology Based on LTCC Substrate Microwave

作　　者：李俊生[1] 

机构地区：[1]盐城师范学院物理科学与电子技术学院,江苏盐城224005

出　　处：《南京工业职业技术学院学报》2011年第2期31-33,共3页Journal of Nanjing Institute of Industry Technology

摘　　要：基于低温共烧陶瓷(LTCC)技术已经成为无源元件集成的主流技术,对低温共烧陶瓷(LTCC)包括LTCC的工艺、基板上电路互连和基板上电路的布局等技术进行了深入的研究,在基板电路互连中我们得出接地通孔用梅花形排列更佳,传输线连接利用同心圆过孔连接更佳。该技术将加速国内电子装备的国产化进程,并产生良好的经济效益和社会效益。This paper, based on the fact that LTCC （LTCC） technology has become a mainstream technology for integrated passive components, makes a deep study of low temperature co-fired ceramic （LTCC） technology, including LTCC substratc and the circuit interconnection and layout of the circuit techniques on the substrate. It holds that the circuit ground interconnection through holes arranged in shape of the plum blossom and transmission lines connected in concentric circles are better. The technology will accelerate the speed of the process of electronic equipment in China, and produce good economic and social benefits.

关 键 词：微波集成电路 多芯片组件 低温共烧陶瓷 

分 类 号：TN405[电子电信—微电子学与固体电子学]